Semiconductor - Shanghai YiNGUAN Semiconductor Technology Co., LTD

Precision Motion System for TGV Drilling Equipment

With the explosive demand for AL, HPC and 5G chips, 3D advanced packaging has become a highly competitive field. The TGV (glass through hole) technology, as a key component of it, is experiencing rapid growth!

Advanced packaging TGV precise motion control semiconductor equipment motion system innovative technology

Precision Motion System for Nanoimprint Equipment

Nanoprinting technology, acclaimed as "the light of next-generation micro-nano manufacturing", is leveraging its remarkable strengths in high resolution, high efficiency and low cost to spark a revolution in semiconductors, AR/VR, biochips, new materials

Wafer manufacturing nano-imprinting

Precision Motion System for Mask Inspection Equipment

From the challenges at the nanoscale to the birth of "Xuanji - Image Analysis": A breakthrough in terms of precision

Chip manufacturing quantity inspection mask plate inspection precise motion system

Advanced Packaging Wafer Die Bonder Motion System

Advanced packaging is a concept derived from advanced wafer processes, generally refers to packaging technology that integrates different systems into the same package to achieve more efficient system performance.

Advanced Packaging Wafer Thinning Equipment Motion System

In the first half of 2024, the global semiconductor industry shows signs of recovery. With the rapid development of AI and HPC, the requirements for chip performance and power consumption are continuously increasing. Chiplet and 2.5D/3D technologies are d

Advanced Packaging Wafer Dicing equipment Motion System

The wafer dicing equipment is a critical piece of equipment in the semiconductor back-end packaging and testing process, particularly for wafer dicing and WLP (wafer-level packaging) dicing. A single wafer usually comprises hundreds or even thousands of c