Advanced Packaging - Shanghai YiNGUAN Semiconductor Technology Co., LTD

Precision Motion System for TGV Drilling Equipment

With the explosive demand for AL, HPC and 5G chips, 3D advanced packaging has become a highly competitive field. The TGV (glass through hole) technology, as a key component of it, is experiencing rapid growth!

Advanced packaging TGV precise motion control semiconductor equipment motion system innovative technology

Advanced Packaging Wafer Die Bonder Motion System

Advanced packaging is a concept derived from advanced wafer processes, generally refers to packaging technology that integrates different systems into the same package to achieve more efficient system performance.

Advanced Packaging Wafer Thinning Equipment Motion System

In the first half of 2024, the global semiconductor industry shows signs of recovery. With the rapid development of AI and HPC, the requirements for chip performance and power consumption are continuously increasing. Chiplet and 2.5D/3D technologies are d

Advanced Packaging Wafer Dicing equipment Motion System

The wafer dicing equipment is a critical piece of equipment in the semiconductor back-end packaging and testing process, particularly for wafer dicing and WLP (wafer-level packaging) dicing. A single wafer usually comprises hundreds or even thousands of c

Advanced Packaging Hybrid Bonding Equipment Motion System

Hybrid bonding is the core path to achieve high-density stacking. With the improvement of vertical interconnection of multiple chips driven by high performance computing, the traditional micro-bump technology is faced with solder electromigration, thermal